| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent flaws, cracks, etc., on a semiconductor wafer as well as improve productivity in the processes from polishing of a rear surface of the semiconductor wafer through dicing. SOLUTION: Since a dicing device 10 is provided with peeling means 17, a semiconductor wafer W with a protection tape on a circuit surface thereof is carried to the dicing process and integrated with a frame, then the protection tape is peeled in the dicing device. The dicing process and the protection tape peeling process are performed simultaneously in the dicing device to improve the productivity.</p> |
