| 摘要 |
PROBLEM TO BE SOLVED: To reduce the dynamic stress and to easily obtain high durability and high reliability of a cheap resin-sealed integrated circuit by adhering one surface of an integrated circuit onto a substrate and holding the other surface of the circuit with a sealing resin in a non-adhesion or weak adhesion state. SOLUTION: The surface of an integrated circuit is partly treated with by a material that inhibits adhesion between an integrated circuit and a sealing resin to hold the treated surface and the sealing resin in a non-adhesion or weak adhesion state. As the material that is previously applied on a part of the integrated circuit for holding it in the non-adhesion or weak adhesion state with the sealing resin, a wax such as vegetable wax, an animal wax or petroleum wax that is solid at ordinary temperature is used as an adhesion inhibitor being effective even when any type of the sealing resin e.g. is used and the effect is different in the type of the sealing resin. Thus, it is possible to realize a more flexible state on the interface between the integrated circuit and the sealing agent and an adhesive respectively and also to reduce the dynamic stress with respect to the sealing agent and the adhesive against the integrated circuit. |
