| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the throughput of a wafer inspection by detecting the peripheral part form of a wafer while the wafer is moved from a delivery part to a microscope optical axis position, and detecting the decentering and declination error. SOLUTION: A sensor consisting of a light source 48, a collimator lens 49, an imaging lens 50 and a line sensor 51 is provided in a position between a microscope optical axis and a wafer delivery part. A wafer 1 is passed through the position of the sensor by driving a stage, and the circumferential form and the position of notch or orientation flat are detected. The photoelectric conversion signal of the line sensor 51 is supplied to a line sensor signal circuit 52, and further supplied to an arithmetic part 44. The wafer 1 held by a syringe 38 is moved from the delivery part to the microscope optical axis. In conformity to the size of the wafer inputted from an instruction input part 46 and the position of the notch, a route data recorded in a memory part 45 is selected, and the arithmetic part 44 instructs the control drive of the stage to a control part 47 so as to move the wafer 1 along the moving route according to the route data.</p> |
