TEMPORARY TABLE FOR BATCH WAFERS AND WAFER CHUCKING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a temporary table for attaching/detaching batch wafers that can vacuum uniformly in the vacuum chuck mechanism of a polishing device without failure. SOLUTION: This temporary table for batch wafers has an index table having a plurality of wafer vacuum plates 161 concentrically provided at regular intervals (A), a hollow shaft 163 that bears the central point of the index table and can horizontally rotate the index table (B), a washing solution supply table 162 borne by this hollow shaft 163 and provided at a higher position than the upper surface of the index table to supply a washing solution to a plurality of wafer vacuum plates (C), a pipe provided in the hollow shaft 163 to supply fluid to the plurality of wafer vacuum plates 161 and discharge fluid from the wafer vacuum plates 161 (D), and a pipe provided in the hollow shaft 163 to supply a washing solution to the washing solution supply table 162.