发明名称 |
Method for forming identifying characters on a silicon wafer |
摘要 |
After identifying characters are written on the wafer surface 16 as a pattern of small holes 19 formed with a laser in the wafer I.D. stage of a semiconductor manufacturing process, the wafer surface in the region of the I.D. is polished to break loose deposits of silicon 20 that are left on the wafer surface and the region is then washed. The process prevents semiconductor material deposited on the wafer surface during the laser operation from later breaking off as hard particles that can scratch the surface of the wafer.
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申请公布号 |
US6037259(A) |
申请公布日期 |
2000.03.14 |
申请号 |
US19980075367 |
申请日期 |
1998.05.11 |
申请人 |
VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
LIN, BIH-TIAO;YANG, FU-LIANG |
分类号 |
H01L21/00;H01L23/544;(IPC1-7):H01L21/302 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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