| 摘要 |
PCT No. PCT/JP96/00040 Sec. 371 Date Nov. 27, 1996 Sec. 102(e) Date Nov. 27, 1996 PCT Filed Jan. 12, 1996 PCT Pub. No. WO96/21948 PCT Pub. Date Jul. 18, 1996Electrodes for electrically connecting to the outside are formed along one long side of a rectangular semiconductor chip 20. The electrodes are arranged in two rows, one of output terminals 21 and the other of input terminals 22 and power supply terminals 23, or are arranged in one row of the output terminals, input terminals and power supply terminals. Input protective resistors and static electricity protective diodes 28 for the input terminals are located outside the output terminals to be separated from the output system by at least the size of the output terminals. The external circuit connected to the output terminals 21 of the semiconductor device, for example the wiring 35 extending from the inner leads 33 of a tape carrier 29 are routed inside the electrodes toward the opposite long side of the semiconductor device, so that the wiring area overlaps the top of the semiconductor device in a plan view. Therefore, the mounting area of the semiconductor device can be largely reduced, the package density can be increased, and the longitudinal dimension of a TCP can be minimized.
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