| 摘要 |
PROBLEM TO BE SOLVED: To provide via hole filling paste which can prevent the infiltration of an organic solvent into a via hole dry conductor and maintain the configuration of the via hole dry conductor. SOLUTION: This conductive paste contains a conductive metal, an insulating in organic material, a photopolymerization starting agent and thermosetting resin, and when the total quantity of the conductive metal, the insulating inorganic material and an organic binder, is 100 wt.%, the total quantity of the conductive metal and the insulting inorganic material becomes 70 to 95 wt.% and the weight of the organic binder becomes 5 to 30 wt.%. |
