| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board superior in adhesion by which no peeling between a resin filling layer and an interlayer insulation resin layer occurs by sufficient curing after drying (pre- baking) the resin filling layer. SOLUTION: In a method for manufacturing a printed wiring board in which a core board is provided with a conductor circuit and through holes, the recessed parts and through holes among the conductor circuits are filled with a resin filler and the resin filler is dried, ground, and cured so as to flatten and smoothen the surface of the board. At this time, a hot air is applied at a wind speed of 2.0 m/sec or lower during drying. |
