| 摘要 |
A socket assembly for removably receiving a solder ball of a chip package and methods for forming the same. The socket assembly is a raised construction formed over a substrate and includes a socket, a ball contact structure, and an electrical trace. A relatively thick photoresist layer, which may have a thickness in a range from about 20 microns to about 450 microns, is used in the process of forming the socket assembly. The photoresist layer may have formed therein a patterned opening used as a mold for the socket assembly. Alternatively, the photoresist layer may be an integral and permanent component of the socket assembly. The socket assembly is configured such that a solder ball may-be disposed in the socket so as to be electrically connected to the socket assembly. Optionally, the socket assembly includes one or more ball penetration structures for facilitating the establishment of electrical contact and for adapting the socket assembly to solder balls of different dimensions. The socket assembly limits the amount of vertical deformation of the solder ball so that the chip package remains reusable.
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