Process of assembling an integrated circuit and a terminal substrate using solder reflow and adhesive cure

摘要

A method of assembling an integrated circuit component onto a substrate by the use of a polymer adhesive having fluxing properties and a specified adhesive strength and temperature control volumetric change which is greater than that of a solder to be used between terminals of the component to terminals of the substrate. In the method the uncured polymer adhesive is located between the circuit component and the substrate and as the second component moves into its site position upon the substrate, the uncured polymer adhesive is compressed and is displaced outwardly from between the body of the component and the substrate. In the method, as an exterior force is required to displace the adhesive in this manner, glass microspheres are provided within the adhesive to limit the movement of the integrated circuit components towards the substrate. These microspheres are of a specified grid size and should also be sufficiently large to prevent glass microspheres from becoming trapped between the terminals of the component and of the substrate. The polymer adhesive has fluxing properties which enables it to be partially cured initially to hold the integrated circuit component in its required position, the curing action then being completed during a reflow soldering operation performed to join terminals of the component to the terminals of the substrate.