| 摘要 |
PROBLEM TO BE SOLVED: To obtain a mounting structure of a photo semiconductor device that improves fluctuation of a light signal and heat radiation by mounting a semiconductor device that is thinned by transferring the light signal from the side wall of a package so as to fix the rear surface of an island to a printed-circuit board. SOLUTION: At least a photo detector is fixed onto an island 21, and a periphery is molded with transparent resin as a sealing body 25. A reflection surface 27 is formed at the upper part of a photo detector 3, and a lens is formed on the side surface of the sealing body. Signal light 6 that is emitted from a light-emitting device is reflected on the reflection surface 27, and emits from the lens on the side surface. On the rear surface of the sealing body 25, the rear surfaces of islands 21 and 22 are exposed. The exposed rear surfaces are soldered and fixed onto printed wiring 33 of a printed-circuit board 30. |
