FILM FORMING METHOD AND APPARATUS THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a film forming apparatus for applying a solution uniformly to a desired position of a treating substrate with a good yield of a solution necessary for the film formation. SOLUTION: A film formation apparatus includes a wafer holding body 6 for holding a wafer 1, and a nozzle unit 2 with a discharging hole 40a for jetting a resist solution in a minute linear shape onto a wafer 1. While the wafer holding body 6 and the nozzle unit 2 are moved relative to each other, the resist solution in a minute linear shape is jetted to apply the resist solution to a circuit forming region 1a on the wafer 1.