发明名称 WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To reduce the noises of a signal efficiently by electrically connecting the electrode terminal of a noise filter and a ground layer through a wiring conductor layer having porosity within a specific range. SOLUTION: A noise filter 6 is mounted on the surface of the wiring board 1, a wiring conductor layer 5 having specific thickness and porosity of 4-25% is buried in the surface layer of the wiring board 1 corresponding to the lower region of the electrode terminal 8 of the side of the noise filter 6 connected to a ground layer 4 in the noise filter 6, and the wiring conductor layer 5 and the electrode terminal 8 of the noise filter 6 are connected by solder 9. The wiring conductor layer 5 and the ground layer 4 are joined directly, and the other electrode terminal 10 is joined with a pad 12 formed to the surface layer of the wiring board 1 by solder 9 through a via-hole conductor 11 from a signal line 3. Accordingly, noises from the signal line 3 can be reduced efficiently.</p>
申请公布号 JP2000077852(A) 申请公布日期 2000.03.14
申请号 JP19980245365 申请日期 1998.08.31
申请人 KYOCERA CORP 发明人 TAKESHITA YOSHIHIRO
分类号 H05K3/46;H03H7/01;(IPC1-7):H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址