发明名称 CONSTITUENT SUBSTRATE FOR ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a constituent substrate for electronic devices using the material wherein the electric resistance of a contact part is not raised even when the material comes into contact with the transparent conductive layer such as an ITC (indium-tin oxide), and the electronic devices using the above- mentioned substrate. SOLUTION: Copper is used as a wiring layer in this constituent substrate 2 for electronic devices, and the substrate 2 is characterized by having an indium oxide as a transparent conductive layer 11 and a composite oxide which is mainly composed of one or a plurality kinds of materials selected from zinc, tin, gallium, tallium, magnesium and lead.
申请公布号 JP2000077806(A) 申请公布日期 2000.03.14
申请号 JP19980246337 申请日期 1998.08.31
申请人 FURONTEKKU:KK 发明人 SASAKI MAKOTO;YAMAMOTO KENJI
分类号 G02F1/1343;G02F1/136;G02F1/1362;G09F9/30;H01L21/336;H01L29/417;H01L31/0224;H05K1/09;(IPC1-7):H05K1/09 主分类号 G02F1/1343
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