发明名称 GROUNDING STRUCTURE FOR HOUSING COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a ground fixing excellent in contactness to a housing without the use of jig or tool. SOLUTION: A resin fixing structure 2 has a fixing shape 5 and a semicircle shape on its bottom. 0n a bottom of a grounding metal component 3, a shape 6 formed in semicircle is formed to secure a contact with a housing metal component 1, and on a tip of it, a shape 7 formed in semicircle is formed to secure a smooth contact with other housing metal component 4.
申请公布号 JP2000077859(A) 申请公布日期 2000.03.14
申请号 JP19980245064 申请日期 1998.08.31
申请人 NEC HOME ELECTRONICS LTD 发明人 WATANABE YOSHIKAZU
分类号 H05K5/02;(IPC1-7):H05K5/02 主分类号 H05K5/02
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