| 摘要 |
PROBLEM TO BE SOLVED: To enable conductive granules such as solder balls to be surely transferred onto a semiconductor device at high speed by a method, wherein conductive granules housed in a vessel are agitated by air flow or an inert gas and then fed to a mounting jig. SOLUTION: A hopper 5001 of an depositing head 500 is mounted and fixed to a glass jig 4, so as to enable solder balls as conductive granules to be sucked in through the holes provided in the glass jig 4 from above, and a required number of separate solder balls are fed to the hopper 5001 by a separator through the use of compressed air. At this point, the compressed air is discharged through a gap provided between the lower part of the hopper 5001 and the glass jig 4, and the solder balls are kept in the hopper 5001. Then this compressed air is stopped, compressed air of prescribed pressure is fed through a hose 5019 to agitate solder balls in the hopper 5001, and solder balls are sent into holes provided to the glass jig 4 at a flow velocity of compressed air.
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