BUMP JOINING JUDGING DEVICE AND METHOD, AND SEMICONDUCTOR COMPONENT PRODUCTION DEVICE AND METHOD

摘要

When an electrode (13) of an electronic component (150) and an electrode (21) of a circuit board (20) is joined together via bumps (11, 12) by relatively vibrating the electronic component and the circuit board, a periodic damping detection device (140) and a judging device (141) are used to detect a periodic damping caused by a progress of joining between the bumps and the electrodes and a success or failure of the joining is judged based on the periodic damping. In addition, a waveform during the joining in terms of an impedance, a moving distance of a nozzle (93) or a supply current to a VCM (121) in an ultrasonic oscillator (133) is compared to that of an acceptable product for judging an acceptability. The above constitution makes it possible to judge a success or failure of joining between the electronic component and the circuit board during the joining and moreover to prevent a defective product with an enhanced yield because a joining condition can be changed during the joining if a joining condition is found deteriorated.