发明名称 |
Steckerartiges Gehäuse für einen integrierten Halbleiterschaltkreis |
摘要 |
A jack-type semiconductor integrated circuit package with a jack-type connector instead of conventional leads. This package comprises a semiconductor chip which is provided with a plurality of bond pads, a jack housing which is adapted to electrically connect the package to a printed circuit board (PCB) and connected to a plurality of connection pins, a resin film which electrically connects the bond pads of the semiconductor chip to the connection pins of the jack housing, bonds the jack housing to the semiconductor chip and contains a plurality of conductive wires and a sealing resin housing which seals both the semiconductor chip and the jack housing and is formed in a predetermined shape by a molding process. The present package makes the operational reliability be improved and is especially suited for providing a high density IC memory chip package. |
申请公布号 |
DE4237267(C2) |
申请公布日期 |
2000.03.09 |
申请号 |
DE19924237267 |
申请日期 |
1992.11.04 |
申请人 |
GOLDSTAR ELECTRON CO., LTD. |
发明人 |
BACK, SEUNG DAE |
分类号 |
H01L23/28;H01L21/56;H01L23/31;H01L23/49;H01L23/498;H01L23/50 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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