| 摘要 |
<p>A package for a device includes a substrate having a common voltage plane and a mounting region. The device is mounted to the mounting region. An electrically conductive dam structure is disposed on the upper surface of the substrate circumscribing the perimeter of the mounting region. The electrically conductive dam structure is coupled to the common voltage plane. An electrically insulating encapsulant at least partially fills the pocket defined by the substrate and the electrically conductive dam structure. The electrically insulating encapsulant contacts the electrically conductive dam structure. An electrically conductive encapsulant overlies the electrically insulating encapsulant and is coupled to the electrically conductive dam structure.</p> |
