METHOD AND DEVICE FOR SURFACE PROCESSING WITH PLASMA AT ATMOSPHERIC PRESSURE

摘要

The invention concerns a method for surface processing with plasma at atmospheric pressure comprising a step which consists in introducing a treating gas in a processing reactor (16), wherein is placed a surface (14) to be processed, between two exciting electrodes (22, 24) and applying a supply voltage to the two electrodes so as to bring about a discharge (12) in the treating gas. The supply voltage is an alternating voltage whereof the amplitude and frequency are adapted to maintain at least part of the treating gas constituents in the excited state and/or the presence of electrons, between two successive alternating supply voltages.