SEMICONDUCTOR DEVICE AND SUBSTRATE FOR SEMICONDUCTOR DEVICE

摘要

A semiconductor device (A) comprises a semiconductor chip (3), a protective package (4) covering the semiconductor chip (3), a first lead (1), and a second lead (2). The semiconductor chip (3) is placed on an inner end (10a) of the first lead (1). The semiconductor chip (3) is connected through wire (W) with an inner end (20a) of the second lead (2). The first lead (1) includes an outer part (11) projecting from the protective package (4), and the second lead (2) includes an outer part (21) projecting from the protection package (4). The two outer parts (11, 21) are flat.