Metal matrix composite component, used as a heat sink or heat dissipating circuit carrier in electronics or as a cooker plate, comprises porous recrystallized silicon carbide infiltrated with a metal or alloy

摘要

Metal matrix composite (MMC) component, comprising porous recrystallized silicon carbide (15) infiltrated with a metal or alloy (14). Preferred Features: The infiltration material (14) is selected from Mg, Zn, Fe, Al, Cu, Si and their alloys. The component may include a body (2) of electrically insulating material (especially ceramic or diamond), of the infiltration material or of a porous reinforcing material infiltrated with the infiltration material.