| 摘要 |
PROBLEM TO BE SOLVED: To prevent the adherent from disposition by providing a board with a movement preventing means to prevent the movement of the adherent when soldering paste is applied on the pattern top of the board and the adherent is soldered to the board by melting the soldering paste in a reflow furnace. SOLUTION: Soldering paste is applied on the top face of a land portion 8 of a product board 1. A soldered portion 9 of a metallic piece (adherent) 2 is placed on the soldering paste, and the other end portion of the metallic piece (adherent) 2 overlapped with a waste board 5 is fixed on the waste board 5 with a movement preventing means A. A holder A1 as the movement preventing means A is composed of a holding plate 11 and clips 12 at both ends of the holding plate 11. The holding plate 11 is placed on the top faces of multiple metallic pieces (adherents) 2 and clipped with the clips 12 to hold the waste board 5 and the metallic pieces (adherents) 2, thus preventing the movement of the metallic pieces (adherents) 2. The board 3 is inserted and heated in the reflow furnace and the soldering paste is melted. |
