发明名称 Process of selectively producing refractory metal silicide uniform in thickness regardless of conductivity type of silicon thereunder
摘要 Amorphous silicon layers are formed on an n-type single-crystal/poly-crystal layer and a p-type single-crystal/poly-crystal layer, and titanium is sputtered on the amorphous silicon layers; although the n-type dopant impurity are piled on the n-type single-crystal/poly-crystal layers, the amorphous silicon layers takes the piles of n-type dopant impurity thereinto, and promote the silicidation of the titanium layer.
申请公布号 US6033978(A) 申请公布日期 2000.03.07
申请号 US19960754519 申请日期 1996.11.21
申请人 NEC CORPORATION 发明人 FUJII, KUNIHIRO;WATANABE, HIROHITO
分类号 H01L21/28;H01L21/285;H01L21/336;H01L21/768;H01L21/8238;(IPC1-7):H01L21/476;H01L21/44;H01L21/320 主分类号 H01L21/28
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