发明名称 TRANSFER MOLDING MACHINE AND METHOD FOR SEALING AND MOLDING SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To provide a transfer molding machine for holding a molding pressure of a molding material charged in a cavity constant even if an amount of the material is changed. SOLUTION: The transfer molding machine moves down an upper plunger 7, moves up a lower plunger 8 in the state that an opening within an upper pot 3 of a runner 5 is closed, pressurizes to compress a powder particle-like molding material 10 in a lower pot 1, then moves up the plunger 7 to open the opening with the pot 3 of the runner 5, moves up the plunger 8 to inject the material 10 in the pot 1 in the cavity 6 via the runner 5. In the machine, a pressure regulating unit 11 for regulating a spring pressure of a pressure regulating spring 9 according to an upward moving stroke of the plunger 8 in the case of pressurizing to compress the material 10 in the pot 1 immediately before completion of injection of the material 10 in the cavity 6 is provided.
申请公布号 JP2000071280(A) 申请公布日期 2000.03.07
申请号 JP19980240589 申请日期 1998.08.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SAKUMA SHOICHI
分类号 B29C45/26;B29C45/02;B29C45/14;B29L31/34;H01L21/56;(IPC1-7):B29C45/02 主分类号 B29C45/26
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