发明名称 |
Prepreg process for producing the same and printed circuit substrate/board using the same |
摘要 |
The present invention provides a printed circuit substrate comprising a lightweight prepreg and a conductive layer. The prepeg having uniform formation, low linear thermal expansion coefficient and good mechanical strength, comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or the thermosetting resin, a process for producing the same, and a printed circuit substrate/board using the same.
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申请公布号 |
US6033765(A) |
申请公布日期 |
2000.03.07 |
申请号 |
US19980102542 |
申请日期 |
1998.06.23 |
申请人 |
SUMITOMO CHEMICAL COMPANY, LIMITED |
发明人 |
TAKAHASHI, TSUTOMU;TSUJIMOTO, YOSHIFUMI;KUMADA, HIROAKI;SATO, HIROYUKI |
分类号 |
B32B15/14;C08J5/04;C08J5/24;C09D5/25;H05K1/03;(IPC1-7):B23B3/00 |
主分类号 |
B32B15/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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