发明名称 Anodization control for forming offset between semiconductor circuit elements
摘要 A circuit substrate includes a plurality of semiconductor devices including electrodes, a wiring having a plurality of branched portions and mainly formed of a metal material, a terminal for applying a voltage to the wiring to anodize the branched portions, and an anodization controller for controlling degrees of anodization of the branched portions. The branched portions serve as the electrodes of the semiconductor devices. The terminal is connected to the wiring.
申请公布号 US6033940(A) 申请公布日期 2000.03.07
申请号 US19970961259 申请日期 1997.10.30
申请人 SHARP KABUSHIKI KAISHA 发明人 JINDA, AKIHITO
分类号 H01L29/786;H01L21/321;H01L21/336;H01L21/66;H01L21/77;H01L21/84;H01L23/544;(IPC1-7):H01L21/89 主分类号 H01L29/786
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