发明名称 |
Thermosetting resin compositions containing maleimide and/or vinyl compounds |
摘要 |
In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.
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申请公布号 |
US6034195(A) |
申请公布日期 |
2000.03.07 |
申请号 |
US19950460495 |
申请日期 |
1995.06.02 |
申请人 |
DEXTER CORPORATION |
发明人 |
DERSHEM, STEPHEN M.;PATTERSON, DENNIS B.;OSUNA, JR., JOSE A. |
分类号 |
C07D207/44;C07D207/452;C07D401/04;C08G73/10;C08G73/12;(IPC1-7):C08F222/40 |
主分类号 |
C07D207/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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