| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin paste containing a specific liquid epoxy resin, a latent curing agent, an imidazole compound and an inorganic filler as essential components, capable of carrying out rapid curing in oven curing, having high adhesive strength in heating, excellent in relaxing property to stress and useful for adhesion between a large-sized chip of IC, etc., and a copper frame. SOLUTION: This resin paste consists essentially of (A) 100 pts.wt. liquid epoxy resin comprising (i) an epoxy resin of the formula [(n)>=0] and (ii) a reactive diluent having epoxy group [e.g. n-butylglycidyl ether] and containing the components (i) and (ii) at a ratio of 60:40 to 90:10, (B) 0.5-5 pts.wt. latent curing agent (e.g. adipic acid hydrazide), (C) 0.5-10 pts.wt. imidazole compound (e.g. 2-methylimidazole) and (D) inorganic filler (e.g. silver powder). An additive such as a silane coupling agent or a titanate coupling agent can be used as the resin paste. |
