RESIN COMPOSITION AND HEAT-RESISTANT RETURNABLE IC TRAY OBTAINED BY MOLDING SAME

摘要

PROBLEM TO BE SOLVED: To provide repeatedly usable, heat-resistant returnable IC trays which have antistatic properties, high heat resistance and excellent mechanical properties and are small in warpage and strain and good in wearing characteristics. SOLUTION: Resin compositions comprise (A) 100 pts.wt. resin composition containing a thermoplastic polyimide resin, (B) 10-80 pts.wt. carbon fiber, (C) 1-100 pts. mica, and (D) 0.1-50 pts.wt. internal release agent. Heat-resistant returnable IC trays can be obtained by molding there resin compositions.