发明名称 Semiconductor substrate and method of making same
摘要 A semiconductor substrate is provided that exhibits very low substrate resistance while also providing structural integrity and robustness to resist breakage during manufacturing. The invention also provides methods of making these semiconductor substrates. The semiconductor substrate includes a planar surface and a recess extending below the planar surface. Preferred substrates include a plurality of recesses arranged in an array.
申请公布号 US6033489(A) 申请公布日期 2000.03.07
申请号 US19980086654 申请日期 1998.05.29
申请人 FAIRCHILD SEMICONDUCTOR CORP. 发明人 MARCHANT, BRUCE DOUGLAS;SAPP, STEVEN;WELCH, THOMAS
分类号 H01L21/306;H01L21/336;H01L29/06;H01L29/78;(IPC1-7):H01L21/302 主分类号 H01L21/306
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