发明名称 |
Semiconductor substrate and method of making same |
摘要 |
A semiconductor substrate is provided that exhibits very low substrate resistance while also providing structural integrity and robustness to resist breakage during manufacturing. The invention also provides methods of making these semiconductor substrates. The semiconductor substrate includes a planar surface and a recess extending below the planar surface. Preferred substrates include a plurality of recesses arranged in an array.
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申请公布号 |
US6033489(A) |
申请公布日期 |
2000.03.07 |
申请号 |
US19980086654 |
申请日期 |
1998.05.29 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORP. |
发明人 |
MARCHANT, BRUCE DOUGLAS;SAPP, STEVEN;WELCH, THOMAS |
分类号 |
H01L21/306;H01L21/336;H01L29/06;H01L29/78;(IPC1-7):H01L21/302 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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