| 摘要 |
<p>PROBLEM TO BE SOLVED: To apply deep engraving at a given depth to a processing area by moving a processing material in a direction perpendicular to a moving direction while a laser light is iteratively moved in a fixed direction at high velocity, and applying pattern processing and frame processing due to a sublimation action of the laser light. SOLUTION: When a laser light LA is oscillated along the longitudinal direction of a processing hole B at high velocity and moved in a fixed direction for forming one groove, an XY table 8 is oscillated in a horizontal direction for forming another groove. By repeating this, a large number of grooves are formed in an area of the processing hole B. Then, frame processing is applied along an outer surface of the shape of the processing hole B. The above- mentioned action is repeated until the pattern processing number, namely a processing layer number N is matched with the layer number of a given deep engraving distance. Then, semi-frame processing is applied, and a slight residual inclined taper of an end wall is further removed, so that the edge wall is processed to an approximately rectangular condition. The semi-frame processing is repeated plural times per layer, and processing is completed when a deep engraving distance becomes a given depth.</p> |
