发明名称 Wafer polishing apparatus with retainer ring
摘要 A rubber sheet is arranged between a head body and a retainer ring of a wafer holding head. Two O-rings air-tightly close a space between the periphery of the rubber sheet, which is located above the retainer ring, and the head body. When a pump supplies the compressed air to the space, the periphery of the rubber sheet is elastically deformed to press the retainer ring under uniform pressure.
申请公布号 US6033292(A) 申请公布日期 2000.03.07
申请号 US19980084782 申请日期 1998.05.27
申请人 TOKYO SEIMITSU CO., LTD. 发明人 INABA, TAKAO
分类号 B24B37/04;B24B37/30;B24B37/32;B24B41/06;B24B49/16;(IPC1-7):B24B5/00 主分类号 B24B37/04
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