| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of liquid ejection recording head in which a silicon wafer can be cut into individual unit elements without requiring high cutting accuracy while protecting the chip surface against damage at the cutting part, and a cut end face of the unit element for enhancing the arranging accuracy thereof can be attained. SOLUTION: A tape 3 is mounted on the rear surface of a silicon wafer 1 where a plurality of unit elements 2 are formed and then the silicon wafer is cut from the surface side into individual unit elements 2. A tape 5 is then mounted on the surface of the unit elements 2 and the wafer 1 is turned over. Subsequently, a cutting blade 7 is run along a cutting groove 11 from the rear side directing upward to cut the initially mounted tape 3 and the remainder or irregularities 12 in the vicinity of the bottom face of the unit element 2. Finally, the unit elements 2 are separated by expanding the tape 5 to obtain an unit element 2 having end face of high arranging accuracy with rough cutting accuracy.
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