| 摘要 |
PROBLEM TO BE SOLVED: To improve adhesion property with a resin without changing the structure of a copper surface by dipping a copper coating film in an electroless copper plating bath coating a sulfur compd. SOLUTION: As for a sulfur compd. to be added to an electroless copper plating bath, a sulfide inorg. compd. such as sodium sulfide and ammonium hydrogen sulfide, a thiocyanate compd. such as thiocyanic acid, an org. sulfide compd. such as thiomalic acid, thioglycolic acid are exampled and it is desirably added by about 0.01 to 50 mg/L in the electroless plating bath. As for the electroless copper plating bath in which the sulfur compd. is added, a normal electroless copper plating bath can be used, and as for a reducing agent, formaldehyde or its deriv. is preferably used. In the electroless plating bath, formaldehyde, a hypophosphite or its derives. are used as the reducing agent and for other than those, copper nitrate as a copper ion source, tartaric acid or its salt as a complexing agent of a copper ion can be used. It may be enough to dip a copper film in the plating bath at 50 to 70 deg.C for about 5 to 30 min.
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