| 摘要 |
PROBLEM TO BE SOLVED: To prevent the falling of depositions from a deposition preventive board in the process of vapor deposition, to easily remove depositions from the deposition preventive board after the completion of the vapor deposition and to reutilize the deposition preventive board by heating the deposition preventive board before the arrival of material vapor thereto and cooling the deposition preventive board simultaneously with the start of the arrival of the material vapor to the deposition preventive board by the action of vapor deposition. SOLUTION: Preferably, in the case the action of vapor deposition is temporarily interrupted, heating for a deposition preventive board is again executed from the time of point at which, by the interruption, the arrival of the material vapor to the deposition preventive board is stopped, simultaneously with the restart of the action of the vapor deposition, cooling for the deposition preventive board is executed, and in the case the action of the vapor deposition is finally finished, the cooling or the deposition preventive board is continued. Even in the case the vapor deposition is temporarily interrupted and is restarted like this, the falling of depositions from the deposition preventive board is prevented, and, moreover, after the completion of the vapor deposition, the removal of depositions from the deposition preventive board is made easy. As the deposition preventive board, e.g. stainless having 3 mm sheet thickness is used, and it is made a square-shaped hollow structure of 20 mm thickness. As for the material, in addition to stainless, the one different in physical properties and m.p. such as copper, cobalt, nickel or the like may be used.
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