发明名称 RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a resin molding having excellent appearance by suppressing occurrence of a weld line. SOLUTION: In the resin molding obtained by injection molding a resin composition attained by adding a lustering agent to thermoplastic resin, total light ray transmissivity of the molding in the case of 1 mm of a thickness of the molding except the agent is 25 to 65%. The composition has 0.4 to 1.0 of an FF value in the case of a mirror surface molding. This thermoplastic resin contains 60 to 95 wt.% of a nylon and 5 to 40 wt.% of a polypropylene in 100 wt.% of its resin component.
申请公布号 JP2000071274(A) 申请公布日期 2000.03.07
申请号 JP19980240688 申请日期 1998.08.26
申请人 TOYODA GOSEI CO LTD 发明人 WATANABE SATORU;KOIZUMI JUNJI;OGASAWARA YUTAKA
分类号 B29C45/00;B29K77/00;C08K3/10;C08L77/00;C08L101/00;(IPC1-7):B29C45/00 主分类号 B29C45/00
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