发明名称 GROUNDING STRUCTURE OF MULTI-LAYERED HEAT INSULATING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a grounding structure of a multi-layered heat insulating material which is capable of easily and partially attaching/detaching the multi-layered heat insulating material (MLI), and surely grounding the multi-layered head insulating material by the outboard activity of an astronaut in a space. SOLUTION: A grounding structure of a multi-layered heat insulating material comprises a fixed multi-layered heat insulating material 12 and an attachable/detachable multi-layered heat insulating material 14, and has grounding parts 12a, 14a lapped on each other on its end part. An upper surface and a lower surface of the grounding part 12a are electrically connected to each other by an electrically conductive metallic plate 6, and the electrically conductive metallic plate 6 is mechanically grounded by a grounding wire 9. An electrically conductive tape 16a are fitted to the electrically conductive metallic plate 6 located on an upper surface of the grounding part 12a of the fixed multi-layered heat insulating material 12 is fitted with an electrically conductive adhesive 17. Metallic layers to constitute the attachable/detachable multi-layered heat insulating material 14 are electrically connected to each other, and the electrically conductive tape 16a and another attachable/detachable electrically conductive tape 16b are fitted to the electrically conductive metallic plate 6 located on the lower surface of the grounding part 14a of the attachable/detachable multi-layered heat insulating material with the electrically conductive adhesive 17.
申请公布号 JP2000072100(A) 申请公布日期 2000.03.07
申请号 JP19980242329 申请日期 1998.08.27
申请人 ISHIKAWAJIMA HARIMA HEAVY IND CO LTD 发明人 NAKATANI HIDETOSHI
分类号 B64G1/58;B32B7/02;(IPC1-7):B64G1/58 主分类号 B64G1/58
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