发明名称 METHOD OF FORMING METAL SILICIDE LAYER SELECTIVELY
摘要 PURPOSE: A method of forming metal silicide layer selectively is provided to prevent a leakage current or a deterioration of electrostatic discharge isolation property due to a metal silicide layer formed in undesired position. CONSTITUTION: The method is comprising the steps of forming an interlayer insulating layer on desired position of a lower structure composed of silicon, patterning the interlayer insulating layer for exposing region where want to form the metal silicide layer, depositing a metal layer on the overall resultant, forming the metal silicide layer only on the region where the interlayer insulating layer is removed by heat-treating the resultant. The metal is composed of a titanium or a cobalt.
申请公布号 KR20000013433(A) 申请公布日期 2000.03.06
申请号 KR19980032290 申请日期 1998.08.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, EUN CHEOL;RYU, JAE HYEON;LEE, WEON GYU
分类号 H01L21/28;(IPC1-7):H01L21/28 主分类号 H01L21/28
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