发明名称 |
METHOD OF FORMING METAL SILICIDE LAYER SELECTIVELY |
摘要 |
PURPOSE: A method of forming metal silicide layer selectively is provided to prevent a leakage current or a deterioration of electrostatic discharge isolation property due to a metal silicide layer formed in undesired position. CONSTITUTION: The method is comprising the steps of forming an interlayer insulating layer on desired position of a lower structure composed of silicon, patterning the interlayer insulating layer for exposing region where want to form the metal silicide layer, depositing a metal layer on the overall resultant, forming the metal silicide layer only on the region where the interlayer insulating layer is removed by heat-treating the resultant. The metal is composed of a titanium or a cobalt.
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申请公布号 |
KR20000013433(A) |
申请公布日期 |
2000.03.06 |
申请号 |
KR19980032290 |
申请日期 |
1998.08.08 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, EUN CHEOL;RYU, JAE HYEON;LEE, WEON GYU |
分类号 |
H01L21/28;(IPC1-7):H01L21/28 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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地址 |
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