LEAD FORMING DIE HAVING DOUBLE FORMING AREA

摘要

PURPOSE: A lead forming die is provided to prevent a spring-back phenomenon and a stripping phenomenon of a lower and an upper dies using a first and a second forming areas. CONSTITUTION: The die comprises a lower die on which a semiconductor package is placed and an upper die in which a cam bending leads of the package is formed. A double forming area includes a first forming area forming the lead at one position of the respective lead and a second forming area, formed on an external side of the first forming area, supporting the formed lead. The first forming area corresponds to the second forming area in a gearing region of the lower and the upper dies, and each of the leads is contacted with the dies through the areas.