发明名称 ROBOT BLADE FOR TRANSFERRING A WAFER
摘要 PURPOSE: A robot blade for transferring a wafer is provided to prevent a distortion of a flat zone in loading a wafer. CONSTITUTION: The robot blade comprises: a board connected to a robot arm which operates according to a program established beforehand; a rear shoe and a front shoe forming a pocket on the board to load the wafer; a sensor established on the board for sensing a loading state of the wafer; and a control projection established in a central region of the rear shoe to lead the flat zone of the wafer which will be loaded to the pocket so that the flat zone can not be distorted.
申请公布号 KR20000014056(A) 申请公布日期 2000.03.06
申请号 KR19980033265 申请日期 1998.08.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SON, BYEONG IN
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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