发明名称 |
ROBOT BLADE FOR TRANSFERRING A WAFER |
摘要 |
PURPOSE: A robot blade for transferring a wafer is provided to prevent a distortion of a flat zone in loading a wafer. CONSTITUTION: The robot blade comprises: a board connected to a robot arm which operates according to a program established beforehand; a rear shoe and a front shoe forming a pocket on the board to load the wafer; a sensor established on the board for sensing a loading state of the wafer; and a control projection established in a central region of the rear shoe to lead the flat zone of the wafer which will be loaded to the pocket so that the flat zone can not be distorted.
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申请公布号 |
KR20000014056(A) |
申请公布日期 |
2000.03.06 |
申请号 |
KR19980033265 |
申请日期 |
1998.08.17 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SON, BYEONG IN |
分类号 |
H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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