发明名称 |
MANUFACTURING METHOD OF A TRENCH ISOLATION |
摘要 |
PURPOSE: A manufacturing method of an isolation trench is provided to prevent a dent of a nitride liner caused by an over-etch of the nitride liner, the dent generated at an edge part of an upper region of the isolation trench. CONSTITUTION: The manufacturing method comprises the steps of: forming a mask pattern for defining the isolation trench region by partially etching a pad oxidation layer and a nitride layer; forming a trench by using the mask pattern to partially etch a part of a semiconductor substrate; forming a thermal oxidation layer on the bottom and sidewalls of the trench; forming a nitride liner on the thermal oxidation layer of which an etch rate is lower than that of the nitride layer of the mask pattern; filling up the trench with a trench isolation layer on the nitride liner; etching the trench isolation layer until an upper part of the mask pattern on both sides of the trench is exposed; and etching the mask pattern.
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申请公布号 |
KR20000013841(A) |
申请公布日期 |
2000.03.06 |
申请号 |
KR19980032936 |
申请日期 |
1998.08.13 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, DOH YEONG;HONG, JIN GI |
分类号 |
H01L21/76;(IPC1-7):H01L21/76 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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