| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having an improved temp. cycle resistance after mounting. SOLUTION: Ball lands 7A at regions apt to peel because of a large stress after mounting have a diameter large enough to increase the contact area of the lands 7A with solder balls 6, thereby enhancing the adhesion strength to avoid peeling. The solder vol. at the regions with large-diameter lands is also increased to avoid poor connection at mounting because of lowered ball height. The diameter of the lands 7A is designed to be equivalent to the conventional ball height when two solder balls are mounted. There is no need to replace mounting solder balls according to the ball lands 7 in the ball-mounting step, this omitting complicated works. |
