发明名称 CHAMBER WALL TEMPERATURE CONTROL SYSTEM
摘要 PURPOSE: A chamber wall temperature control system is provided to maintain the inside temperature of a plasma chamber with the optimum fabrication conditions. CONSTITUTION: The system comprises of a temperature sensor (328) installed on a temperature control pad (320), monitoring the temperature of a chamber wall (300) and applying a signal by a controller (600) comparing the obtained temperature value of the chamber wall (300) with a set temperature value defined beforehand as the optimum temperature of fabrication conditions, calculating a controlled variable, and correspondingly controlling the on-off operation of control valves (440a,440b); control valves (440a, 440b) opening when the temperature of the chamber wall (300) is higher than a set temperature; and a coolant supplied from its central source of supply (500), circulating through a cooling line (324) and cooling the temperature control pad (320). Thus, the chamber wall (300) heated by RF (Radio Frequency) high voltage during plasma fabrication is cooled. If the temperature of the chamber wall (300) reaches a set temperature through the cooling, the controller (600) discriminates it by a monitoring signal of the temperature sensor (328), and controls the output, and shuts control valves (440a, 440b). Thereby, the coolant circulating through an injection line (420a) and a discharge line (420b) is blocked, and the cooling of the chamber wall (300) discontinues.
申请公布号 KR20000014055(A) 申请公布日期 2000.03.06
申请号 KR19980033264 申请日期 1998.08.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KO, UNG;CHOI, PYONG-MUK;YU, TOK-SU;KIM, CHONG-MYONG
分类号 H01L21/02;(IPC1-7):H01L21/02 主分类号 H01L21/02
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