发明名称 HEAT RADIATION PLATE OF ELECTRONIC COMPONENTS
摘要 PURPOSE: A heat radiation plate improved a connecting matter to connect an electronic component and the heat radiation plate is provided to increase the assembled property of the electronic component and the heat radiation plate. CONSTITUTION: The connecting matter to do the role of a screw comprises of:a screw unit(53) connected to penetrate connecting slots(h1)(h2) formed each in an electronic component(1) and in a base(11) of the heat radiation plate(10); a head unit(51) extended in all directions in the one end of the screw unit(53); a circular plate spring(52) to do the role of a facing ring by integrally forming between the screw unit(53) and the head unit(51) to flexibly contact the face in the electronic component(1).
申请公布号 KR20000013048(A) 申请公布日期 2000.03.06
申请号 KR19980031699 申请日期 1998.08.04
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JUNG, SUNG GON;KIM, HONG KI;KANG, CHUN SUNG
分类号 F28F3/06;(IPC1-7):F28F3/06 主分类号 F28F3/06
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