发明名称 |
HEAT RADIATION PLATE OF ELECTRONIC COMPONENTS |
摘要 |
PURPOSE: A heat radiation plate improved a connecting matter to connect an electronic component and the heat radiation plate is provided to increase the assembled property of the electronic component and the heat radiation plate. CONSTITUTION: The connecting matter to do the role of a screw comprises of:a screw unit(53) connected to penetrate connecting slots(h1)(h2) formed each in an electronic component(1) and in a base(11) of the heat radiation plate(10); a head unit(51) extended in all directions in the one end of the screw unit(53); a circular plate spring(52) to do the role of a facing ring by integrally forming between the screw unit(53) and the head unit(51) to flexibly contact the face in the electronic component(1).
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申请公布号 |
KR20000013048(A) |
申请公布日期 |
2000.03.06 |
申请号 |
KR19980031699 |
申请日期 |
1998.08.04 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JUNG, SUNG GON;KIM, HONG KI;KANG, CHUN SUNG |
分类号 |
F28F3/06;(IPC1-7):F28F3/06 |
主分类号 |
F28F3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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