发明名称 METHOD FOR ELECTROPLATING CERAMIC SURFACE AND APPARATUS FOR ELECTROPLATING
摘要 PURPOSE: A method for electroplating piezo ceramic surface and an apparatus for electroplating are provided, which the time required for electroplating is shortened and the binding strength of the ceramic is increased. CONSTITUTION: The apparatus comprises a temperature detector (2) detecting the amount of heat emission emitted from the surface of the ceramic substrate (1); a differentiator (3) for distinguishing signals; a comparator (4) comprising a comparison circuit; a controlling circuit for a control switch operating a time relay (5) and a generator (7) for heating dielectric; and an apparatus for opening and closing (15) between both the electrodes (11, 12). The generator (7) is connected to both electrodes (11, 12) and a wire (14) in a space isolated by an insulating plate (13) and a cover plate (16), a dielectric cover (10) and dielectric (9) capable of binding many ceramic substrates (1) are equipped between the electrodes (11, 12), The dielectric cover (10) forms many emission spheres (18) inducing the amount of heat emission from the substrate (1) to the temperature detector (2), and the emission spheres (18) and the temperature detector (2) are connected to a tube of rays (8) having a polymer thin film (17) in the upper part. The ceramic surface is electroplated by pasting a solid of silver-containing metals on the piezo ceramic surface, inserting a ceramic product between the two plates of dielectric material having high tangent angle (0.08-1.0), and heating it at high frequency electromagnetic wave.
申请公布号 KR20000012785(A) 申请公布日期 2000.03.06
申请号 KR19990062143 申请日期 1999.12.24
申请人 AN, SON TAE 发明人 AN, SON TAE
分类号 C23C18/00;(IPC1-7):C23C18/00 主分类号 C23C18/00
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