WAFER LOADING DEVICE OF DRY ETCHING EQUIPMENT FOR FABRICATING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A wafer loading device of a dry etching equipment for fabricating a semiconductor device is provided to reduce a separating/coupling process of a flange for supporting a lead screw. CONSTITUTION: The flanges are respectively inserted to a center and an end of the lead screw for supporting a revolvable lead screw. An incision groove is downwardly formed in a penetration hole of the flange. A width of the incision groove is larger than a diameter of the lead screw. If the flange is separated from the lead screw, a worker can separate the lead screw from the incision groove extended to the penetration hole without separating a nut or a screw, a flange, and a poly assembly.