发明名称 |
METHOD TO REMOVE OXIDATION FILM IN SALICIDE PROCESS |
摘要 |
PURPOSE: Method to remove oxidation film in the salicide (self aligned silicide) process is provided which can solve the problem of an increase in surface resistance caused by oxidation film on the surface of silicide in the salicide process. CONSTITUTION: Silicide is formed by RTS (Rapid Thermal Silicidation) process (S10) and strip (S12). After strip, remove the oxidation film on the silicide with dry etching (S14) or wet etching. And the problem of an increase in surface resistance caused by the remaining oxidation film can be solved.
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申请公布号 |
KR20000013443(A) |
申请公布日期 |
2000.03.06 |
申请号 |
KR19980032304 |
申请日期 |
1998.08.08 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YANG, HEE SEOK;KIM, YOUNG NAM;HWANG, KYUNG HWAN;BAK, DU HYUN |
分类号 |
H01L21/31;(IPC1-7):H01L21/31 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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