| 摘要 |
PROBLEM TO BE SOLVED: To obtain a gold wire for forming a bump electrode and a manufacturing method thereof, that can realize stable bonding by reducing irregularities in the lengths of a broken gold wire, on forming bump electrode and by achieving stable height for the bump. SOLUTION: The breaking strength of a gold wire is set between 95 and 80% of the breaking strength of a rise on drawing by heating the gold wire. This arrangement enables the removal of processing distortion and to recover the structure of the gold wire to that before recrystallization. Hence, it is possible to minimize irregularities in a length h1 of a broken gold wire, when forming a bump electrode 8 and to stabilize a height h2 of a bump and to eliminate bending and a curling on the gold wire and a normal ball can be formed. |
