| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the quality of products, and to extend maintenance cycle by preventing a film deposited and accumulated in a reaction tube from being peeled and deposited on a substrate. SOLUTION: In this semiconductor manufacturing device having a substrate susceptor 28 for horizontally holding a substrate 6 to be processed in a reaction chamber 2, a foreign matter shielding board 32 can be held at the upper part of the held position of the substrate to be processed by the substrate susceptor. Thus, even if a film deposited and accumulated in a reaction tube is peeled off at accumulating of a semiconductor film on the substrate to be processed in the reaction chamber, the peeled-off film can be prevented from being deposited on the substrate to be processed by the foreign matter shielding board.</p> |
